Develop new and innovative technologies for materials joining.
The Centre for Advanced Materials Joining is one of perhaps 10 facilities of its kind in the world, offering multidisciplinary expertise to develop new and innovative technologies for materials-joining. Joining technology is advancing rapidly and is crucial to global competitiveness. One of the fastest growing joining segments is microjoining, which has expanded beyond traditional interconnections and packaging for microelectronics. Today, microjoining is also vital in the development of sensors, transducers, medical devices and optoelectronics. This has given rise to new scientific questions requiring research.
- Welding of advanced high-strength steel, Laser welding and resistance spot welding
- Welding of magnesium, Electromagnetic welding, resistance spot welding and laser welding
- Nanojoining and nanofabrication, Wet chemical work station, high-temperature furnaces, autoclave reactor, spin coating, Femtosecond laser systems, Nd:YAG laser system, nanoindentation
- Wire bonding, Mechanical testing (tensile, hardness [microhardness & nanoindenter]), modelling and simulation (COMSOL, ABAQUS, ANSYS), microsensors (low-stress bonding, long-term reliability, bonding failure mechanism), sample preparation (mechanical polishing, ion milling, chemical etching), microscopy (optical & scanning electron microscopes)
- Microwelding, Resistance micro-welding and laser micro-welding
- Friction stir welding and processing, Lightweight alloys (Al, Mg), dissimilar material welding (Al, Mg to steel), friction stir processing of nanocomposites
- Aerospace and satellites
- Automotive
- Defence and security industries
Specialized labs and equipment
Equipment |
Function |
---|---|
Resistance spot welding equipment
|
Friction Stir Welder Single Phase Spot Welder MFDC Spot Welder Unitek 500 Series Spot Welder Miyachi Unitek Series 300 Spot Welder THIN-LINE Series 80 Spot Welder |
Micro-plasma welding equipment |
Micro-plasma arc welder |
Wire-bonding equipment |
Automatic wire bonders Manual wire bonders |
Laser welding equipment |
Miyachi LW-50A Low Power Laser NUVONYX ISL-4000L Diode Laser IPG YLR-500 Ytterbium Fiber Laser IPG YLS-6000 Fiber Laser |
Nanojoing and Nanofabrication |
Wet chemical work station High-temperature furnaces Autoclave reactor, spin Coating Femtosecond laser |
Analytical equipment |
Nano-Indenter Micro X-Ray Diffraction Machine WYKO NT1100 Optical Profiler Instron 5548 Micro Tester Dage 4000 Multi Purpose Tester Olympus BX51M System Metallurgical Microscope Fischerscope X-Ray Scientech SM124D Analytical Balance |
Equipment for specimen preparation |
Accuton-50 Wafer Cutting Machine Model 1010 Low Angle Ion Milling and Polishing System Ecomet 3 Variable Speed Grinder-Polisher |
Private and public sector research partners
- ArcelorMittal Dofasco Inc.
- Canadian Solar Inc.
- CenterLine (Windsor) Ltd.
- Magna International Inc.
- Smarter Alloys
- Microbonds Inc.
- Huys Industries
- Emcara Gas Development Inc. TransCanada Corporation
- Celestica Inc.
- International Lead Zinc Research Organization
- Medtronic of Canada Ltd.
- Kulicke & Soffa
- MK Electron Co. Ltd.
- POSCO/RIST (Research Institute of Industrial Science and Technology)